化學成分 NX3008CBKS

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估?？蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù)，這是安世半導體為半導體產(chǎn)業(yè)設下的一個行業(yè)標準。安世半導體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934065639115	NX3008CBKS,115	NX3008CBKS	SOT363 (SC-88)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 135655 ppm; substance 7440-48-4: 1633 ppm; substance 1333-86-4: 267 ppm; substance 7439-92-1: 3 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 135655 ppm; substance 7440-48-4: 1633 ppm; substance 1333-86-4: 267 ppm; substance 7439-92-1: 3 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-57-5: 944 ppm; substance 7440-22-4: 7066 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die 1	Doped silicon	Silicon (Si)	7440-21-3	0.036412	91.030000	0.668222
		Die Total		0.036412	91.030000	0.668222
Die 1	Pure metal layer	Aluminium (Al)	7429-90-5	0.001016	2.540000	0.018645
		Die Metallization 1 Total		0.001016	2.540000	0.018645
Die 1	Pure metal layer	Gold (Au)	7440-57-5	0.002572	6.430000	0.047201
		Die Metallization 2 Total		0.002572	6.430000	0.047201
		Die 1 Total		0.040000	100.000000	0.734068

Die 2	Doped silicon	Silicon (Si)	7440-21-3	0.036412	91.030000	0.668222
		Die Total		0.036412	91.030000	0.668222
Die 2	Pure metal layer	Aluminium (Al)	7429-90-5	0.001016	2.540000	0.018645
		Die Metallization 3 Total		0.001016	2.540000	0.018645
Die 2	Pure metal layer	Gold (Au)	7440-57-5	0.002572	6.430000	0.047201
		Die Metallization 4 Total		0.002572	6.430000	0.047201
		Die 2 Total		0.040000	100.000000	0.734068

Lead Frame	Iron-nickel alloy	Iron (Fe)	7439-89-6	0.981180	47.400000	18.006313
Lead Frame	Iron-nickel alloy	Nickel (Ni)	7440-02-0	0.739197	35.710000	13.565515
Lead Frame	Iron-nickel alloy	Manganese (Mn)	7439-96-5	0.017595	0.850000	0.322898
Lead Frame	Iron-nickel alloy	Cobalt (Co)	7440-48-4	0.008901	0.430000	0.163348
Lead Frame	Iron-nickel alloy	Silicon (Si)	7440-21-3	0.005382	0.260000	0.098769
Lead Frame	Iron-nickel alloy	Chromium (Cr)	7440-47-3	0.004347	0.210000	0.079775
Lead Frame	Iron-nickel alloy	Aluminium (Al)	7429-90-5	0.001863	0.090000	0.034189
Lead Frame	Iron-nickel alloy	Carbon (C)	7440-44-0	0.000828	0.040000	0.015195
Lead Frame	Iron-nickel alloy	Sulfur (S)	7704-34-9	0.000414	0.020000	0.007597
Lead Frame	Iron-nickel alloy	Phosphorus (P)	7723-14-0	0.000414	0.020000	0.007598
Lead Frame	Pure metal layer	Copper (Cu)	7440-50-8	0.271377	13.110000	4.980227
		Pre-Plating 1 Total		0.271377	13.110000	4.980227
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.038502	1.860000	0.706577
		Pre-Plating 2 Total		0.038502	1.860000	0.706577
		Lead Frame Total		2.070000	100.000000	37.988001

Mould Compound	Filler	Silica	7631-86-9	2.102400	72.000000	38.582596
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	0.438000	15.000000	8.038041
Mould Compound	Polymer	Formaldehyde-phenol copolymer	9003-35-4	0.292000	10.000000	5.358694
Mould Compound	Additive	Non-declarable		0.084680	2.900000	1.554021
Mould Compound	Pigment	Carbon black	1333-86-4	0.001460	0.050000	0.026794
Mould Compound	Additive	Triphenylphosphine	603-35-0	0.001460	0.050000	0.026793
		Mould Compound Total		2.920000	100.000000	53.586939

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.369963	99.990000	6.789447
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000018	0.005000	0.000330
Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.000011	0.003000	0.000202
Post-Plating	Impurity	Copper (Cu)	7440-50-8	0.000004	0.001000	0.000074
Post-Plating	Impurity	Bismuth (Bi)	7440-69-9	0.000004	0.001000	0.000073
		Post-Plating Total		0.370000	100.000000	6.790126

Wire	Pure metal	Copper (Cu)	7440-50-8	0.009089	100.000000	0.166798
		Wire Total		0.009089	100.000000	0.166798

		NX3008CBKS Total		5.449089		100.000000

Notes
Report created on 2025-03-08 20:12:59 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-03-08 20:12:59 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導體芯片 (Die)	?	?	?	?	?	?
半導體芯片金屬化層1 (Die Metallization 1)	?	?	?	?	?	?
半導體芯片金屬化層2 (Die Metallization 2)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
半導體芯片金屬化層3 (Die Metallization 3)	?	?	?	?	?	?
半導體芯片金屬化層4 (Die Metallization 4)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
預鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-03-08 20:12:59 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 NX3008CBKS

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產(chǎn)品(AEC-Q100/Q101)

化學成分 NX3008CBKS

ESD保護、TVS、濾波和信號調節(jié)ESD保護