LSF0204-Q100
參數(shù)類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LSF0204GU12-Q100 | 0.8?-?5.0 | 0.8?-?5.0 | CMOS | + 64 | 0.6 | 4 | low | -40~125 | 203 | 9.1 | 110 | XQFN12 |
| LSF0204PW-Q100 | 0.8?-?5.0 | 0.8?-?5.0 | CMOS | + 64 | 0.6 | 4 | low | -40~125 | 141 | 7.7 | 68 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| LSF0204GU12-Q100 | LSF0204GU12-Q100X (935691321115) |
Active |
XQFN12 (SOT1174-1) |
SOT1174-1 | SOT1174-1_115 | ||
| LSF0204PW-Q100 | LSF0204PW-Q100J (935690965118) |
Active | LSF0204 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| LSF0204GU12-Q100 | LSF0204GU12-Q100X | LSF0204GU12-Q100 |
|
|
| LSF0204PW-Q100 | LSF0204PW-Q100J | LSF0204PW-Q100 |
|
|
文檔 (10)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| LSF0204_Q100 | 4-bit bidirectional multi-voltage level translator; open-drain; push-pull | Data sheet | 2024-07-25 |
| AN90050 | Pin FMEA for LSF family | Application note | 2023-12-14 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| lsf0204pw | LSF0204PW IBIS model | IBIS model | 2020-05-18 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | Package information | 2024-04-11 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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