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GaN D-mode vs E-mode: A clash of technologies? Or the perfect co-existence?

Wednesday, March 19, 2025
11:30-11:55AM ET
Level Four, A404/405

GaN transistors can be made normally-on (D-mode) or normally-off (E-mode). In this presentation we examine the relative merits of the two approaches & study how best to apply the right technology to the right application space. Considered are applications calling for low-voltage (40V to 150V) & high-voltage (600-700V) ratings, as well as current ratings in the range of 10A to 100A, per FET. We identify the differing fundamental device characteristics, correlate these differing characteristics to differing performance metrics, & finally draw conclusions regarding how best to apply each.

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Board Level Reliability of Gull-Wing, Micro-Leaded & Lead-Less Packaged MOSFETs in Automotive Environments.

Wednesday, March 19, 2025
3:40 PM – 4:00 PM ET  
Level Three, A316

This paper examines the board-level reliability of surface-mount power MOSFET packages in automotive applications.Even when AEC-Q101 standards are met, package footprint invetiably affects board level reliablity. Thermomechanical simulations alongside experimental tests were performed on 3x3 mm² micro-leaded MOSFETs showing a strong correrlation between between experimental and simulation data. Temperature cycling (-55°C to 150°C) compared gull-wing, micro-leaded, & leadless packages to assess solder fatigue. Using the double power law model, the study predicted MOSFET lifespan on a PCB, finding gull-wing leaded MOSFETs offer the highest longevity, followed by micro-leaded & lead-less packages.

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Optimizing MOSFET Selection for EMC-Critical Automotive Applications

Thursday, March 20, 2025
09:00 AM – 09:20 AM ET
Level Three, A315

This paper examines how device parameters influence ringing & EMC in low-voltage silicon Superjunction MOSFETs in a half-bridge configuration. The damping factor quantifies drain current oscillations, with simulations & experiments validating its impact on the low-side device. EMC sweeps link oscillation behavior to electromagnetic interference. By analyzing internal MOSFET parameters like die size & integrated snubber, the study identifies optimal design choices for automotive applications, improving ringing performance without modifying the external circuit.

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Experimental validation of triangular SOA via infrared thermography of MOSFETs dies during thermally unstable linear mode for automotive applications

Thursday, March 20, 2025 
11:10 AM – 11:30 AM ET 
Level Three, A315

This paper examines how device parameters affect ringing & EMC in low-voltage silicon Superjunction MOSFETs in a half-bridge configuration. The damping factor quantifies drain current oscillations, validated through simulations & experiments. EMC sweeps link oscillation behavior to electromagnetic interference. By analyzing internal MOSFET parameters like die size & integrated snubber, the study identifies optimal design choices for automotive applications, improving ringing performance without modifying the external circuit.

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Powering the Future: Efficient Energy Harvesting for Sustainable Electronics

Wednesday, March 19, 2025 
12:45 PM - 1:15 PM ET
Location: A302

Battery-powered systems face energy limits, costly replacements, & environmental impact, with 78 million IoT batteries discarded daily. As demand for compact, efficient electronics grows, these challenges intensify. Energy harvesting offers a sustainable solution by capturing ambient energy from light, heat, & motion, reducing battery reliance. This session explores how it extends battery life, simplifies design, & enables sustainable power for IoT & wearables. Learn how Nexperia’s chip innovations drive energy-efficient, maintenance-free devices.

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Advancing power electronics with Nexperia’s 650 V IGBT technology: high efficiency solutions for Industrial and Automotive applications

Tuesday, March 18, 2025 
3:00 PM - 3:30 PM ET
Location: Expo Theater 4

Nexperia’s 650 V IGBT series delivers high-efficiency switching, low conduction losses, & robust performance for industrial & automotive applications. Designed for demanding environments, these devices offer high current capability & excellent thermal management. This session explores their advantages in motor drives, power supplies, EV traction inverters, & power grid infrastructure, highlighting efficiency, scalability, & support for next-generation electrification trends.

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