化學成分 NEX5204100BV

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導體已決定直接通過互聯網發(fā)布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估?？蛻艨梢灾苯訌囊话惝a品數據庫檢索中獲取這些詳細的數據，這是安世半導體為半導體產業(yè)設下的一個行業(yè)標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
935692283518	NEX5204100BVY	NEX5204100BV	SOT8109-1 (HWQFN16)	RFS	3

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 47 ppm; substance 1333-86-4: 2155 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 47 ppm; substance 1333-86-4: 2155 ppm; substance 7440-43-9: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 12296 ppm; substance 7440-57-5: 3 ppm; substance 7440-05-3: 30 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.422218	77.900000	1.149299
Adhesive	Polymer	Acrylic resin		0.082384	15.200000	0.224254
Adhesive	Polymer	Resin system		0.037398	6.900000	0.101799
		Adhesive Total		0.542000	100.000000	1.475352

Die	Doped silicon	Silicon (Si)	7440-21-3	1.857024	99.840000	5.054915
Die	Pure metal layer	Titanium (Ti)	7440-32-6	0.000372	0.020000	0.001013
		Die Metallization 1 Total		0.000372	0.020000	0.001013
Die	Pure metal layer	Tungsten (W)	7440-33-7	0.001116	0.060000	0.003038
		Die Metallization 2 Total		0.001116	0.060000	0.003038
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.001488	0.080000	0.004050
		Die Metallization 3 Total		0.001488	0.080000	0.004050
		Die Total		1.860000	100.000000	5.063016

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	16.887853	97.370000	45.969603
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.393709	2.270000	1.071696
Lead Frame	Copper alloy	Zinc (Zn)	7440-66-6	0.026016	0.150000	0.070817
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.005203	0.030000	0.014163
Lead Frame	Impurity	Lead (Pb)	7439-92-1	0.001734	0.010000	0.004720
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.029485	0.170000	0.080259
		Pre-Plating Total		0.029485	0.170000	0.080259
		Lead Frame Total		17.344000	100.000000	47.211258

Mould Compound	Filler	Silica fused	60676-86-0	13.860000	87.500000	37.727631
Mould Compound	Filler	Silica	7631-86-9	0.950400	6.000000	2.587038
Mould Compound	Polymer	Epoxy resin system		0.633600	4.000000	1.724692
Mould Compound	Polymer	Phenolic resin		0.316800	2.000000	0.862346
Mould Compound	Pigment	Carbon black	1333-86-4	0.079200	0.500000	0.215586
		Mould Compound Total		15.840000	100.000000	43.117293

Post-Plating	Tin alloy	Tin (Sn)	7440-31-5	1.094484	99.952900	2.979242
Post-Plating	Impurity	Bismuth (Bi)	7440-69-9	0.000164	0.015000	0.000446
Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.000105	0.009600	0.000286
Post-Plating	Impurity	Copper (Cu)	7440-50-8	0.000088	0.008000	0.000240
Post-Plating	Impurity	Iron (Fe)	7439-89-6	0.000078	0.007000	0.000212
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000027	0.002500	0.000073
Post-Plating	Impurity	Arsenic (As)	7440-38-2	0.000027	0.002500	0.000073
Post-Plating	Impurity	Aluminium (Al)	7429-90-5	0.000011	0.001000	0.000030
Post-Plating	Impurity	Zinc (Zn)	7440-66-6	0.000011	0.001000	0.000030
Post-Plating	Impurity	Cadmium (Cd)	7440-43-9	0.000005	0.000500	0.000014
		Post-Plating Total		1.095000	100.000000	2.980646

Wire	Pure metal	Copper (Cu)	7440-50-8	0.054712	97.700000	0.148929
Wire	Impurity	Non-declarable		0.000056	0.100000	0.000152
Wire	Pure metal layer	Gold (Au)	7440-57-5	0.000112	0.200000	0.000305
		Wire Coating 1 Total		0.000112	0.200000	0.000305
Wire	Pure metal layer	Palladium (Pd)	7440-05-3	0.001120	2.000000	0.003049
		Wire Coating 2 Total		0.001120	2.000000	0.003049
		Wire Total		0.056000	100.000000	0.152435

		NEX5204100BV Total		36.737000		100.000000

Notes
Report created on 2025-03-08 20:12:55 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-03-08 20:12:55 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯苯 (PBB)	多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
半導體芯片金屬化層1 (Die Metallization 1)	?	?	?	?	?	?
半導體芯片金屬化層2 (Die Metallization 2)	?	?	?	?	?	?
半導體芯片金屬化層3 (Die Metallization 3)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
預鍍層 (Pre-Plating)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?
導線涂層1 (Wire Coating 1)	?	?	?	?	?	?
導線涂層2 (Wire Coating 2)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-03-08 20:12:55 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 NEX5204100BV

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 NEX5204100BV

ESD保護、TVS、濾波和信號調節(jié)ESD保護