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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 NEX5208000BY

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評估??蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
935692282518NEX5208000BYYNEX5208000BYSOT8041-2 (HWQFN24)RFS3
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 2143 ppm; substance 7439-92-1: <1 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 2143 ppm; substance 7439-92-1: <1 ppm; substance 7440-43-9: <1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 24160 ppm; substance 7440-05-3: 44 ppm; substance 7440-57-5: 4 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.37236277.9000001.007795
AdhesivePolymerAcrylic resin0.07265615.2000000.196643
AdhesivePolymerResin system0.0329826.9000000.089265
Adhesive Total0.478000100.0000001.293703
DieDoped siliconSilicon (Si)7440-21-32.10662499.8400005.701561
DiePure metalTitanium (Ti)7440-32-60.0004220.0200000.001142
DiePure metal layerTungsten (W)7440-33-70.0012660.0600000.003426
Die Metallization 1 Total0.0012660.0600000.003426
DiePure metal layerAluminium (Al)7429-90-50.0016880.0800000.004569
Die Metallization 2 Total0.0016880.0800000.004569
Die Total2.110000100.0000005.710698
Lead FrameCopper alloyCopper (Cu)7440-50-816.39008094.50000044.359617
Lead FrameCopper alloyIron (Fe)7439-89-60.4023812.3200001.089041
Lead FrameCopper alloyZinc (Zn)7440-66-60.0173440.1000000.046941
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0138750.0800000.037553
Base Alloy Total16.82368097.00000045.533152
Lead FramePure metal layerSilver (Ag)7440-22-40.5203203.0000001.408242
Pre-Plating Total0.5203203.0000001.408242
Lead Frame Total17.344000100.00000046.941394
Mould CompoundFillerSilica fused60676-86-013.86000087.50000037.511976
Mould CompoundFillerSilica7631-86-90.9504006.0000002.572250
Mould CompoundPolymerEpoxy resin system0.6336004.0000001.714833
Mould CompoundPolymerPhenolic resin0.3168002.0000000.857417
Mould CompoundPigmentCarbon black1333-86-40.0792000.5000000.214354
Mould Compound Total15.840000100.00000042.870830
Post-PlatingTin alloyTin (Sn)7440-31-51.09448499.9529002.962212
Post-PlatingImpurityBismuth (Bi)7440-69-90.0001640.0150000.000444
Post-PlatingImpurityAntimony (Sb)7440-36-00.0001050.0096000.000284
Post-PlatingImpurityCopper (Cu)7440-50-80.0000880.0080000.000238
Post-PlatingImpurityIron (Fe)7439-89-60.0000770.0070000.000208
Post-PlatingImpurityArsenic (As)7440-38-20.0000280.0025000.000076
Post-PlatingImpurityLead (Pb)7439-92-10.0000270.0025000.000073
Post-PlatingImpurityAluminium (Al)7429-90-50.0000110.0010000.000030
Post-PlatingImpurityZinc (Zn)7440-66-60.0000110.0010000.000030
Post-PlatingImpurityCadmium (Cd)7440-43-90.0000050.0005000.000013
Post-Plating Total1.095000100.0000002.963608
WirePure metalCopper (Cu)7440-50-80.07933297.7000000.214711
WireImpurityNon-declarable0.0000820.1000000.000222
WirePure metal layerPalladium (Pd)7440-05-30.0016242.0000000.004395
Wire Coating 1 Total0.0016242.0000000.004395
WirePure metal layerGold (Au)7440-57-50.0001620.2000000.000439
Wire Coating 2 Total0.0001620.2000000.000439
Wire Total0.081200100.0000000.219767
NEX5208000BY Total36.948200100.000000
Notes
Report created on 2025-06-02 12:36:41 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2025-06-02 12:36:41 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)??????
半導(dǎo)體芯片 (Die)??????
半導(dǎo)體芯片金屬化層1 (Die Metallization 1)??????
半導(dǎo)體芯片金屬化層2 (Die Metallization 2)??????
基底合金 (Base Alloy)??????
預(yù)鍍層 (Pre-Plating)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
導(dǎo)線 (Wire)??????
導(dǎo)線涂層1 (Wire Coating 1)??????
導(dǎo)線涂層2 (Wire Coating 2)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-06-02 12:36:41 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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