化學成分 NSF040120L3A0

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導體已決定直接通過互聯(lián)網發(fā)布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估?？蛻艨梢灾苯訌囊话惝a品數據庫檢索中獲取這些詳細的數據，這是安世半導體為半導體產業(yè)設下的一個行業(yè)標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934665927127	NSF040120L3A0Q	NSF040120L3A0	SOT429-2 (TO247-3L)	RFS	None

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 1622 ppm of the article. SCIP No. 72cff671-3be6-4935-9b41-015f709bf43a.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 1622 ppm; substance 7440-02-0: 133 ppm; substance 1333-86-4: 1761 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 1622 ppm; substance 7440-02-0: 133 ppm; substance 1333-86-4: 1761 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 26 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon carbide	Silicon carbide (SiC)	409-21-2	1.727000	100.000000	0.028699
		Die Total		1.727000	100.000000	0.028699

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	4034.591604	99.878490	67.047200
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	2.827650	0.070000	0.046990
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	1.211850	0.030000	0.020139
Lead Frame	Impurity	Lead (Pb)	7439-92-1	0.060996	0.001510	0.001014
Lead Frame	Impurity	Non-declarable		0.008079	0.000200	0.000134
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.799821	0.019800	0.013292
		Pre-Plating Total		0.799821	0.019800	0.013292
		Lead Frame Total		4039.500000	100.000000	67.128769

Mould Compound	Filler	Silica fused	60676-86-0	1646.544595	85.450000	27.362424
Mould Compound	Polymer	Epoxy resin system		144.518250	7.500000	2.401617
Mould Compound	Hardener	Phenolic resin		57.807300	3.000000	0.960647
Mould Compound	Additive	Non-declarable		57.807300	3.000000	0.960647
Mould Compound	Pigment	Carbon black	1333-86-4	10.598005	0.550000	0.176118
Mould Compound	Additive	Non-declarable		9.634550	0.500000	0.160108
		Mould Compound Total		1926.910000	100.000000	32.021561

Post-Plating	Pure metal layer	Tin (Sn)	7440-31-5	29.527047	99.990000	0.490683
Post-Plating	Impurity	Non-declarable		0.002953	0.010000	0.000049
		Post-Plating Total		29.530000	100.000000	0.490732

Wire 2	Pure metal	Aluminium (Al)	7429-90-5	9.278542	99.990000	0.154192
Wire 2	Impurity	Nickel (Ni)	7440-02-0	0.000557	0.006000	0.000009
Wire 2	Impurity	Iron (Fe)	7439-89-6	0.000093	0.001000	0.000001
Wire 2	Impurity	Silicon (Si)	7440-21-3	0.000093	0.001000	0.000002
Wire 2	Impurity	Magnesium (Mg)	7439-95-4	0.000093	0.001000	0.000002
Wire 2	Impurity	Copper (Cu)	7440-50-8	0.000092	0.001000	0.000001
		Wire Total		9.279470	100.000000	0.154207
		Wire 2 Total		9.279470	100.000000	0.154207

Wire 1	Pure metal	Aluminium (Al)	7429-90-5	0.212749	99.990000	0.003536
Wire 1	Impurity	Nickel (Ni)	7440-02-0	0.000013	0.006000	0.000000
Wire 1	Impurity	Iron (Fe)	7439-89-6	0.000003	0.001000	0.000000
Wire 1	Impurity	Silicon (Si)	7440-21-3	0.000002	0.001000	0.000000
Wire 1	Impurity	Copper (Cu)	7440-50-8	0.000002	0.001000	0.000000
Wire 1	Impurity	Magnesium (Mg)	7439-95-4	0.000002	0.001000	0.000000
		Wire Total		0.212771	100.000000	0.003536
		Wire 1 Total		0.212771	100.000000	0.003536

Chip Coat	Polymer	3-Aminopropyltrihydroxysilane	58160-99-9	0.000010	100.000000	0.000000
		Chip Coat Total		0.000010	100.000000	0.000000

Solder Wire	Lead alloy	Lead (Pb)	7439-92-1	9.705300	93.500000	0.161284
Solder Wire	Lead alloy	Tin (Sn)	7440-31-5	0.519000	5.000000	0.008625
Solder Wire	Lead alloy	Silver (Ag)	7440-22-4	0.155700	1.500000	0.002587
		Solder Wire Total		10.380000	100.000000	0.172496

		NSF040120L3A0 Total		6017.539251		100.000000

Notes
Report created on 2025-03-08 20:12:58 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導體芯片 (Die)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
預鍍層 (Pre-Plating)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?
芯片涂層 (Chip Coat)	?	?	?	?	?	?
焊錫絲 (Solder Wire)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-03-08 20:12:58 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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所有產品

雙極性晶體管

二極管

ESD保護、TVS、信號調節(jié)

MOSFET

SiC MOSFETs

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車

所有應用

汽車

工業(yè)和電力

移動和可穿戴應用

計算和消費電子

Sub-systems: Power conversion topologies

子系統(tǒng)

參考設計

評估板

Interactive application notes

Advanced Support Tools

化學成分 NSF040120L3A0

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 NSF040120L3A0

ESD保護、TVS、濾波和信號調節(jié)ESD保護