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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 PSMN1R5-30BLE

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過(guò)互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進(jìn)行RoHS指令或無(wú)鉛狀態(tài)合規(guī)評(píng)估??蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934067368118PSMN1R5-30BLEJPSMN1R5-30BLESOT404 (D2PAK)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 9243 ppm of the article. SCIP No. f418fbbb-02c3-4537-b339-5fe68689b4f8.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 3928 ppm; substance 1309-64-4: 7033 ppm; substance 1333-86-4: 781 ppm; substance 7439-92-1: 9243 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 3928 ppm; substance 1309-64-4: 7033 ppm; substance 40039-93-8: 5861 ppm; substance 1333-86-4: 781 ppm; substance 7439-92-1: 9243 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 148 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogens according to Nexperia's halogen-free definition.
RHF-2006 indicator E
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-311.800000100.0000000.808155
Die Total11.800000100.0000000.808155
Lead FrameCopper alloyCopper (Cu)7440-50-8822.50997998.97000056.331837
Lead FrameCopper alloyNickel (Ni)7440-02-05.7343830.6900000.392735
Lead FrameCopper alloyPhosphorus (P)7723-14-01.9945680.2400000.136603
Lead FrameCopper alloyIron (Fe)7439-89-60.8310700.1000000.056918
Lead Frame Total831.070000100.00000056.918093
Mould CompoundFillerSilica fused60676-86-0427.89000075.00000029.305212
Mould CompoundPolymerEpoxy resin system81.77451414.3333305.600551
Mould CompoundPolymerPhenolic resin40.8872867.1666702.800277
Mould CompoundFlame retardantAntimony trioxide (Sb2O3)1309-64-410.2693601.8000000.703325
Mould CompoundFlame retardantEpichlorohydrin-tetrabromobisphenol A copolymer40039-93-88.5578001.5000000.586104
Mould CompoundPigmentCarbon black1333-86-41.1410400.2000000.078147
Mould Compound Total570.520000100.00000039.073616
Post-PlatingTin alloyTin (Sn)7440-31-519.78802199.9900001.355236
Post-PlatingImpurityNon-declarable0.0019790.0100000.000136
Post-Plating Total19.790000100.0000001.355372
Wire 1Pure metalAluminium (Al)7429-90-512.24512599.9900000.838641
Wire 1Pure metalNickel (Ni)7440-02-00.0012250.0100000.000084
Wire Total12.246350100.0000000.838725
Wire 1 Total12.246350100.0000000.838725
Wire 2Pure metalAluminium (Al)7429-90-50.25510699.9900000.017471
Wire 2ImpurityNon-declarable0.0000260.0100000.000002
Wire Total0.255132100.0000000.017473
Wire 2 Total0.255132100.0000000.017473
Solder WireLead alloyLead (Pb)7439-92-113.49597793.5000000.924309
Solder WireLead alloyTin (Sn)7440-31-50.7217105.0000000.049428
Solder WireLead alloySilver (Ag)7440-22-40.2165131.5000000.014829
Solder Wire Total14.434200100.0000000.988566
PSMN1R5-30BLE Total1460.115682100.000000
Notes
Report created on 2025-03-08 20:14:32 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
245 °C40 s220 °C30 s3
Notes
Report created on 2025-03-08 20:14:32 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價(jià)鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)??????
引線框架 (Lead Frame)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
導(dǎo)線 (Wire)??????
導(dǎo)線 (Wire)??????
焊錫絲 (Solder Wire)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無(wú)限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-03-08 20:14:32 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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