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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車(chē)應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

PMCM650CUNE

20 V, Common Drain N-channel Trench MOSFET

N-channel enhancement mode common-drain dual Field-Effect Transistor (FET) in a 6 bumps Wafer Level Chip-Size Package (WLCSP) using Trench MOSFET technology.

此產(chǎn)品已停產(chǎn)

Features and benefits

  • Common-drain type for bi-directional current flow

  • Low threshold voltage

  • Ultra small package: 0.98 × 1.48 × 0.35 mm

  • Trench MOSFET technology

  • ElectroStatic Discharge (ESD) protection > 2 kV HBM

Applications

  • Loadswitch

  • Battery Protection

  • Battery Management

參數(shù)類(lèi)型

型號(hào) Package version Package name Product status Channel type Nr of transistors VGS [max] (V) Tj [max] (°C) QGD [typ] (nC) Ptot [max] (W) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
PMCM650CUNE WLCSP6_3-2 WLCSP6 End of life N 2 8 150 2.9 0.556 0.7 N 480 96 2017-11-08

封裝

下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。

型號(hào) 可訂購(gòu)的器件編號(hào),(訂購(gòu)碼(12NC)) 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
PMCM650CUNE PMCM650CUNEZ
(934070441023)
Withdrawn / End-of-life WLCSP6_3-2
WLCSP6
(WLCSP6_3-2)
WLCSP6_3-2 暫無(wú)信息

環(huán)境信息

下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。

型號(hào) 可訂購(gòu)的器件編號(hào) 化學(xué)成分 RoHS RHF指示符
PMCM650CUNE PMCM650CUNEZ PMCM650CUNE rohs rhf rhf
品質(zhì)及可靠性免責(zé)聲明

文檔 (9)

文件名稱(chēng) 標(biāo)題 類(lèi)型 日期
PMCM650CUNE 20 V, Common Drain N-channel Trench MOSFET Data sheet 2017-11-08
WLCSP6_3-2 3D model for products with WLCSP6_3-2 package Design support 2023-03-13
nexperia_document_leaflet_WLCSP_201803 Small-signal MOSFETs in WLCSP - Smallest size - lowest RDS(on) Leaflet 2018-04-25
nexperia_document_leaflet_WLCSP_201803_CHN WLCSP Chinese Translation Leaflet 2018-04-25
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
nexperia_document_leaflet_WLCSP_201803 Small-signal MOSFETs in WLCSP - Smallest size - lowest RDS(on) Leaflet 2018-04-25
nexperia_document_leaflet_WLCSP_201803_CHN WLCSP Chinese Translation Leaflet 2018-04-25
WLCSP6_3-2 wafer level chip-size package; 6 bumps (3 x 2) Package information 2022-07-13
PMCM650CUNE PMCM650CUNE Spice model SPICE model 2018-07-02

支持

如果您需要設(shè)計(jì)/技術(shù)支持,請(qǐng)告知我們并填寫(xiě) 應(yīng)答表 我們會(huì)盡快回復(fù)您。

模型

文件名稱(chēng) 標(biāo)題 類(lèi)型 日期
PMCM650CUNE PMCM650CUNE Spice model SPICE model 2018-07-02
WLCSP6_3-2 3D model for products with WLCSP6_3-2 package Design support 2023-03-13

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

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