網(wǎng)絡(luò)研討會(huì)
在 Nexperia，我們經(jīng)常組織各種主題的網(wǎng)絡(luò)研討會(huì)。在這里您可以重新觀看研討會(huì)視頻!
Power Rectifier Webinar Series
In Nexperia’s Power Rectifier Webinar Series, Nexperia will explain the importance of clip-bond FlatPower packages in the context of downsizing and PCB design. The right package choice is not only essential when it comes to availability and long-term supply security. The increasing demand for miniaturization leads to more compact board designs and therefore the thermal power dissipation is becoming a real challenge for designers. Nexperia will help you to understand the concept of the thermal resistance Rth in depth. Furthermore, temperature differences between conventional SMX and CFP rectifier packages are investigated and compared with regards to downsizing potential and board layout. In this webinar you will learn how to make the most out of your design with flat power packages.
Package Technology for Electronic Design Engineers
This digital webinar will focus on how to increase power density and reliability while reduce size and parasitics using CFP and DFN packages. The webinar will consist of three parts. The first part will highlight thermal performance of clip-bonded Clip Flat Power packages (CFP). The second part will demonstrate the benefits of Discretes Flat No-Leads packages (DFN) compared to standard leaded SMD packages. Lastly, the third part will explain reliability profile ‘tested beyond AECQ-101’ and what is behind Board Level Reliability testing.
Lost in translation - Selecting the right translator
This webinar series covers the multitude of solutions available in voltage translation, also known as level shifting. Session 1 addresses the technical requirements for translation and look at the wide variety of options for translation. While session 2 looks at very specific applications and identifies the best translator solution.
Understanding advanced logic translators and level shifters
The digital webinar will focus on Nexperia translators for special applications: auto direction sense, multi-voltage translators, I2C and SIM/SD card interfaces. Session 1 will provide an overview of translator technology, product overviews and Nexperia’s strategy and roadmap for these devices. While Session 2 will provide detailed configuration and application information.
Logic Applications and Design
In this webinar, applications and innovations in logic devices for the automotive and industrial markets will be covered. It will focus on on Q100 reliability certification, preferred package types for high-reliability applications, and analog switch design including current injection and thermal resistance measurements.
Logic Device Selection
This webinar will cover Logic device selection from the wide variety of process and packages available as well as roadmaps and new product introductions. We are also pleased to announce the latest in our series of Engineering Handbooks - “Logic Applications”.